PRODUCTS
Product Categories
Product Categories

Loctite 3549

Retail price
0.0
Market price
0.0
Number of views:
1000
Product serial number
Quantity
-
+
Stock:
Category
Return
1
Product description
Parameters
Parameter

Loctite and Hysol circuit board-level CSP / BGA underfills are easy to maintain; meanwhile, they have good vibration and shock resistance. Loctite underfill has the advantages of fast flow, fast curing and long working life. Its mature Fluxill and Corner Bonding technology can be easily added to the current SMT process flow, eliminating the need for additional underfill Dispensing and curing processes greatly save time and money.

Scan the QR code to read on your phone
We could not find any corresponding parameters, please add them to the properties table
 

Huizhou Extension Taikang Chemical Co.,Ltd.

 

ADD:New Energy Technology Building, Beibei Section, S357 Province, Chenjiang Town, Huizhou City
Tel:0752-3290186  3103280
E-mail:
hsxw2008@163.com

关注我们

Follow us

Copyright::Huizhou Extension Taikang Chemical Co.,Ltd.      粤ICP备10236919号      Powered by www.300.cn